New Thermal Imaging based Electronic Inspection System from FLIR Systems

5/15/2000

Turnkey Thermal Inspection System for Electronic Subassemblies and Printed Circuit Boards increases quality control. North Billerica, MA (May 15, 2000) - FLIR Systems, Inc. recently introduced its ThermoVision IRMV Electronics Inspection System specifically designed for time-based thermal characterization, testing, and inspection of electronic circuits and circuit board assemblies. The Electronic Inspection System combines the high-resolution thermal imaging and measurement capabilities of the ThermoVision IRMV camera along with an automated positioning system as well as powerful software for proper thermal classification of components or PCBs. The ThermoVision IRMV Electronics Inspection System will identify missing or faulty components that fail to operate under high stress, poor thermal conductivity, shorts and open connections not allowing critical signals to reach a component. The Electronics Inspection System is self-teaching and will classify faults or rapid diagnosis and repair. FLIR Systems, Inc. (Nasdaq: FLIR) designs, manufactures and markets infrared imaging systems worldwide for a variety of applications. Commercial product applications include predictive maintenance/condition monitoring, non-destructive testing, research and development, manufacturing process control and broadcast imaging. FLIR's imaging products are also used in such diverse applications as public safety, defense, navigation and search and rescue. For more information, please visit the company's web site at www.flir.com.

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